- Operated with Window based software
- Advanced optics design for best system performance
- Safe wafer handler features
- High Power DUV-VIS light source for broad band applications
- Array based detector system to ensure fast measurement
- Measure film thickness and Refractive Index up to 12 layers
- Capable to be used for real time or in-line thickness, refractive index monitoring
- System comes with comprehensive optical constants database and library
- Advanced TFProbe 3.3.X Software allows user to use either NK table, dispersion or effective media approximation (EMA) for each individual film.
- Three different user level control: Engineer mode, system service mode and easy user mode
- Flexible engineer mode for various recipe setup and optical model testing
- Robust one click button (Turn-key) solution for quick and routine measurement
- Configurable measurement parameters, user preference and easiness of operation
- Fully automatic calibration and initialization for system
- Precise sample alignment interface from sample signal directly, no external optics needed
- Precise height adjustment
- Compatible for 300mm wafer application
- Various options, accessories available for special configurations such as mapping stage, wavelength extension, focus spot etc.
- 2D and 3D output graphics and user friendly data management interface
SYSTEM CONFIGURATION:
- Model: SE200BM-M450
- Detector: Detector Array
- Light Source: High Power DUV-Vis-NIR Combined Light Source
- Incident Angle Change: Preset at 70 degree (but manaully adjustable)l
- Stage: 450mm Automatic Mapping stage with Rho-Theta configuration
- Software: TFProbe 3.3.x
- Computer: Intel Duo Core 2.0 GHz
- Monitor 22" Wide Screen LCD
- Power: 110– 240 VAC /50-60Hz, 6 A
- Warranty: One year labor and parts
Thông số kỹ thuật
- Wavelength range: 250 to 850 nm
- Wavelength resolution: 1 nm
- Spot Size: 1 to 5 mm variable
- 1.5mm Edge Exclusion Capability
- Incident Angle Range: 0 to 90 degree (preset at 70 degree)
- Incident Angle Change Resolution: 5 degree interval
- Sample Size: up to 450 mm in diameter
- Substrate Size: up to 2mm thick
- Measurable thickness range*: 0 nm to 20 µm
- Measurement Time: ~ 1s/Site
- Accuracy*: better than 0.25%
- Repeatability*: < 1 Å (1 sigma from 50 thickness readings for 1500 Å Thermal SiO2 on Si Wafer)