* Reduce waste by eliminating the need for coupons
* Measure foil or laminated Cu thickness in µm, mils or oz
* Sort Cu by weight at incoming inspection, before
drilling, shearing or plating
* Measure hot or cold Cu on PCBs
* Quantify Cu thickness after etching or planarizing
* Verify Cu plating thickness on PCB surfaces
Thông số kỹ thuật
* High repeatability and reliability: s = 0.08 µm at 20 µm
(0.003 mils at 0.79 mils)
* Statistical analysis includes data recording, average,
standard deviation and high-low reporting
* Measurement units in µm, mils or oz
User interface in English or Simplified Chinese
* Measure etched traces as thin as 204 µm (8mils) without
line width standards
* Store 9,690 measurements (with optional date and time
stamp)
*Copper thickness is measured using 4-point probe electrical
resistance method and conforms to standard EN 14571.
* Thickness measurement ranges
* Copper Electroless: (0.25-12.7) µm,
(0.01-0.5) mils
* Copper Electrodeposited: (2.0-254) µm,
(0.1-10) mils
* USB 2.0 high-speed data transfer interfaced with
Microsoft ExcelTM
* Factory calibrated and certified
* Customisable for other applications
* Static or continuous mode measurement
* Powered by regular AA batteries
Xem thêm: Copper Plating Thickness Gauge CMI95M Oxford Instrument