- ULTRACOLLIMATOR modules allow the user to produce the finest results of sample parallelism with both flat lapping and selected area preparation machines. The units produce a ‘single box’ solution, incorporating an lcd screen and all the controls required to align the sample.
- The use of optical alignment allows for simpler faster and significantly more accurate alignment to be achieved on a range of sample types and applications including: Crystal polishing, Double side wafer polishing, Topside de-processing of layers of metal circuitry for electronic failure analysis and competitive analyses, Backside polishing of packaged computer dice for ‘through silicon’ microscopy.
- Works in conjunction with tilt controls to control sample alignment
- Improves alignment accuracy up to 20X
- Suits topside & backside electronic sample polishing
- Suits requirements for double sided polishing