- Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation. ULTRA TEC has produced leading solutions for backside preparation since 1999. With over 400 ASAP-1 units installed in Semiconductor industry labs throughout the world, we are proud to introduce the ASAP-1® IPS.
- Ever since the inception of the ASAP-1 Project, ULTRA TEC’s goal has been to offer both user-friendly and sample-friendly tools. The ASAP-1® analog systems offer elegant, intuitive controls which have enabled all labs to achieve quality results for subsequent analysis with Photon emission microscopes, laser/ thermal stimulus microscopes and FIB’s. The user-friendly intutive nature of the analog units has been carried forward, and expanded with ASAP-1® IPS.
- ASAP-1® IPS offers deep sub-micron control on X, Y and Z axes, making it 'hands-down' the most accurate system ever seen in the market.
- ASAP-1® IPS enhances the market-leading attributes of our legacy products with the latest digital technology. It is now possible to grind substrates thinner, polish flatter and de-process even more accurately. ASAP-1® IPS introduces a suite of features that automate many aspects of the process – from analyzing the part to be processed, to writing intuitive programmable recipes, to reading in-situ end-stop indicators that ensure each important sample is prepared correctly. The patented 'float down' polishing head design is retained, and enhanced with the use of force feedback. to achieve the quality of final polish demanded by customers for backside microscopy, Laser scan, FIB and SIL.
- The dedicated machine-vision monitor provides an 'always on' realtime view of the part, overlaid with current system coordinates and parameter. Now you can see the part as it is being processed!
- A touchscreen interface, a physical joystick and encoders -- alongside a suite of intuitive software and hardware features -- empowers the FA technician & engineering professional for the next generation of failure analysis.
- Suits all sizes of die - package, wafer and board-level
- Full 100mm x 100mm stage area
- Always-On Real Time Video Monitor showing system and naviation parameters
- Touchscreen control with physical joystick & controls
- Rigid Table Assembly and closed-loop, high-torque, motor control enhances the machining of tough and hard materials
- X, Y and Z axes all have deep sub-micron accuracy
- Accurately decaps, then thins substrate and polishes
- Patented Floating Head provides a true polishing action -- yields polishing quality & high survivability
- Intuitive menus provide a powerful, easy to use, system
- USB Flash Drive interface for preparation recipe storage
- Short set-up and process times
- Accurate die-tilt adjustment ‘on the fly’
- Bench-top & Quiet in Operation