Destructive determination of dry film thickness of all types of single- or multi-coat systems using the wedge cut method as well as microscopic assessment in order to detect substrate and application defects
Handy cutter holder for protecting the cutter, ensures clear vision for the correct positioning of the cutter
Guide wheels for carrying out straight wedge cuts
Functional, ergonomic, sturdy design
No maintenance necessary
Easy to handle
Thông số kỹ thuật
| Cutters |
Film thickness |
Calculating the film thickness* |
Resolution |
| 5.7° |
2 - 250 µm
(0.08 - 9.84 mil) |
divisor 10 |
2 µm (0.08 mil) |
| 14° |
5 - 500 µm
(0.197 - 19.7 mil) |
divisor 4 |
5 µm (0.197 mil) |
| 26.6° |
10 - 1'000 µm
(0.4 - 39.4 mil) |
divisor 2 |
10 µm (0.4 mil) |
| 45° |
20 - 2'000 µm
(0.8 - 78.7 mil) |
divisor 1 which means you can take the reading directly |
20 µm (0.8 mil) |
>>> Giá bán ZND 2050-2054