Precision shear testing and Cold Bump Pull (CBP)
Big bump removal to prepare for wafer probing
Bump sizes down to 20µm
Available with or without wafer handler (EFEM)
XY mapping coordinates key in function
Grading run functionality
Up to 4 USB Tweezers in 1 RMU
Easy positioning, alignment
High resolution cameras with high and low magnifications
Fastest throughput of wafer bump testing in the world
500mm X-stage and 370mm Y-stage, throat depth 400mm
Integrated report editor and flexible data export
Reach 100% of the 300mm wafer without repositioning the wafer on the chuck
Blower and vacuum tool cleaning unit
Wafer chuck with safety interlocks and 360 degree rotation
Wafer carrier mechanically locked when vacuum is turned on
Complies with JEDEC JESD22-B117A, JEDEC JESD22-B115, JEITA EIAJ ET-7407 and IPC-9708 standards
Also suitable for 200mm (8 inch) and other wafer sizes
24 bit ADC resolution, 10kHz sampling frequency
Compatible with Revolving Measurement Unit (RMU) and single heads
SECS/GEM protocol
Wafer pusher to test warped wafers
Unparallelled 0.075% accuracy