TRUE VERTICAL TECHNOLOGY™ Z-movement 95mm
with 360° Tool rotation; Dispenser, Stamping, Ultrasonic, Scrub,Tool Heating, Pre Form Spindle, ...
XY placement stage supporting:
Waffle - / Gel - Pack -, Substrate - Holder, various Heating Plates
Pick-up from Wafer with Tresky‘s patented die ejector system, especialy suitable for all kind of Si, GaAs and InP dies down to 30µm thickness.