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Máy siêu âm khuyết tật UNITED NDT USONIC 3510, ISONIC 3510

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Máy siêu âm khuyết tật UNITED NDT USONIC 3510, ISONIC 3510

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Máy siêu âm khuyết tật UNITED NDT USONIC 3510, ISONIC 3510


  • Fully parallel 32:32 PA electronics expandable to 64:64 / 128:128 functionality
  • 2 PA probe terminals: 1 X 32:32 / 2 X 16:16 - switchable: there is no external splitter required for operating 2 PA probes simultaneously
  • Ability of work with PA probes carrying up to 64 and 128 elements
  • Independently adjustable emitting and receiving aperture with parallel firing, A/D conversion, and on-the-fly real time digital phasing
  • Phased array pulser receiver with image guided ray tracing / scan plan designer for the numerous types of simple and complex geometry welds, shafts, bolts, spindles, composite profiles, and the like
  • 8192 independently adjustable focal laws
  • Bi-polar square wave initial pulse: up to 300 Vpp / 100 dB analogue gain / 0.2...25 MHz bandpass / 16 bit 100 MHz ADC / 32 taps smoothly tunable digital filter
  • Regular and volume overlay B-Scan / Sector Scan (S-Scan) / Horizontal Plane S-Scan (CB-Scan) coverage accompanied with all-codes-compliant A-Scan based evaluation
  • Multigroup coverage composed of several cross-sectional B- and S-Scans
  • Strip Chart
  • Single group and multigroup Top (C-Scan), Side, End View imaging formed through encoded / time-based line scanning, 3D-Viewer
  • Single side / both sides weld coverage with use of one PA probe / pair of PA probes
  • TOFD Map out of a pair of PA probes
  • Top (C-Scan), Side, End View imaging formed through encoded XY- scanning, 3D-Viewer
  • Built-in automatic coupling monitor and lamination checker for wedged probes
  • Equalized cross sectional coverage sensitivity: TCG-independent gain per focal law adjustment providing pure angle gain compensation for S-Scan, etc
  • DAC, TCG
  • Dynamic Focusing
  • FMC, TFM, Back Diffraction Technique with / without and Mode Conversion
  • Processing of diffracted and mode converted signals for defects sizing and pattern recognition
  • Operating 2D-array probes
  • 100% raw data capturing
  • Automatic alarming defects / generating of editable defects list upon scanning completed
  • Advanced defects sizing and pattern recognition utilities

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