Benefits:
Improves temperature-measurement accuracy
Enhances wafer-to-wafer uniformity
Provides a cost-competitive alternative to thermocouple-based measurements
Increases productivity, yield, and throughput
Features:
Compact, single-channel design
In-situ, non-contact temperature measurement
Support of RS-232 and analog data interfaces at up to 20 temperature readings per second
Improved low-temperature performance