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Key features of the VEGA3 Generation
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High-performance electronics for faster image acquisition and signal processing
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Ultra-fast scanning system with compensated static and dynamic image aberrations
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An extended range of scanning modes using the original Wide Field Optics™
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Unique In-Flight Beam Tracing™ for real-time beam optimization
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Redesigned software control with high level of automation
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Built-in scripting for user-defined applications
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Extra-long filament life-time
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TESCAN VEGA Series Choises
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four chamber types
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SB-, LM- or XM-Chamber (plus special GM-Chamber)
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two vacuum systems
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High Vacuum (H) or
Uni Vacuum (U) for High or Low Vacuum
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two cathode systems
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Tungsten or LaB6 Cathode
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three table options
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Short-, Standard- or Extended-Table
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More features of the VEGA3 Generation
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Unique 4-lens electron optical system (up to 30 kV), PC-controlled to easily switch between modes for high resolution imaging, ultra-low magnification, ultra-high depth of focus and optimised analysis
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Effective automatic functions to control and optimise electron optical parameters, and/or to automate working procedures for fast high-quality results
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Fast and easy 3D stereo imaging via PC-controlled beam deflection with optional 3D surface modelling and analysis
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Sophisticated user interface, easy-to-use software for microscope control under MS Windows™ operating system
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Password-protected, multi-level user accounts
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Comprehensive software for image archiving, measurement, processing, and analysis
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Variable pressure option (LV-/VP-systems with 500 or 2000 Pa)
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Full range of detectors (i.e. BSE, LVSE, etc.), accessories and options
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Full integration of analytical systems via TCP/IP remote access
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TESCAN VEGA Chamber Specifications
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SB
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LM
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XM
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Int. Diameter
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Ø 160 mm
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Ø 230 mm
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290 x 340 mm (w,d)
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Door Width
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120 mm
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148 mm
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290 x 322 mm (w,h)
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Type
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eucentric
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compucentric
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compucentric
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X
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45 mm mot.
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80 mm mot.*
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130 mm mot.
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Y
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45 mm mot.
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60 mm mot.*
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130 mm mot.
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Z
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27 mm man.
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47mm mot.
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100 mm mot.
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Z’
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6 mm man.
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—
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—
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Rotation
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360° mot.
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360° mot.
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360° mot.
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Tilt
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-90 to +90° man.
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-80 to +80° mot.
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-30 to +90° mot.
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Spec. Hight
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34 mm max.
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81 mm max.
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147 mm max.
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VEGA SEMs also available with special GM multi-port chamber
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* Also available with other measurements
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TESCAN VEGA SEM Specifications
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Chamber Type
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SB- / LM- / XM-
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Vacuum Type
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H
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U
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Resolution
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High Vaccum Mode
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3.0 nm (2.0 for LaB6)
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3.0 nm (2.0 for LaB6)
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Low Vacuum Mode
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—
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3.5 nm (2.5 for LaB6)
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Vacuum
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High Vacuum Mode
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< 9*10-3 Pa
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< 9*10-3 Pa
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Low Vacuum Mode
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—
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3 - 500 Pa (optionally 2000 Pa)
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Working Modes
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Resolution, Depth, Field, Wide Field, Channelling
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Magnification
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about 1.5 to 1,000,000x (depending on chamber)
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Detectors Standard
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SE, Touch Alarm, Probe Current Measruement
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SE, BSE, Touch Alarm, Probe Current Measruement
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Detectors Optional
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TE, EBIC, EBSD, EDX, WDX*, BSE, Chamberscope ...
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TE, EBIC, EBSD, EDX, WDX*, LVSTD (to 500 Pa), Chamberscope ...
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Accelerating Voltage
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200 V to 30 kV
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Electron Gun
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Tungsten Heated Cathode or LaB6 Cathode
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Probe Current
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1 pA to 2 µA
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Requirements
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230 V / 50 Hz or 120 V / 60 Hz, 1300 VA, No Water Cooling
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* WDX only with LM or XM Chamber
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Wide Field Optics™ and In-Flight Beam Tracing™ are trademarks of Tescan, a.s.
Windows™ is a trademark of the Microsoft Corporation USA and other countries.
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