Features:
110kV micro-focus ray source, high-resolution flat-panel detector
8-axis motion system, 50 ° tilt to meet the full-angle detection needs
window navigation, easy to track target point
programmable CNC detection, improve detection efficiency
Maximum detection area 300x300mm2
Applications :
1.BGA / CSP / FLIPS CHIP:
bridge, empty, open, multi-tin less tin
2.QFN:
bridge, empty, open, through hole alignment
3.SMT standard components:
QFP, SOT, SOIC, CHIPS, And other related components
4. Semiconductor:
gold wire, broken wire, hole, MOLD VOID
5. Multilayer circuit board (MLB): the
inner hole through the degree of alignment, pad, Blind / Buried vias
Thông số kỹ thuật
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model
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AX8300
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Maximum operating voltage / type of tube
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110kV (optional 90kV) / closed
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Maximum output power
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25W (optional 8W)
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Focus size 1
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7 μm
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System magnification
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1000 times
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Imaging system (optional)
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Flat panel detectors
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Manipulate the shaft
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8-axis movement
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Measurements
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Maximum detection area 300x300mm 2
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Maximum sample weight
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5kg
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monitor
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22 " LCD monitor
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physical dimension
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1100x1100x1650mm
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weight
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1700kg
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Radiation safety 2
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<1μSv / hr (<0.1mR / hr) Measured at 5cm on the surface of the device
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Control
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Keyboard / mouse / joystick
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automatic detection
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Standard
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Main application areas
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Chip detection, electronic components, auto parts
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1. Focus size is a variable, please consult Nissan for information.
2. Radiation Safety Statement: All X-ray equipment manufactured by Nikkei Technology complies with FDA-CDRH CFR 21 1020, 40-J for cabinet X-ray
System requirements, the FDA-CDRH specifies that the amount of X-ray radiation spilled from any surface of the cabinet X-ray system is not allowed to exceed 0.5 millirem / hr.2 & quot ; .
Nikko's X -ray system is less than 15 times the specified value .
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