Product Description:
Japan's independent research and development of AX-DXI image processing system software
to meet a variety of welding points and internal structure of the detection and analysis,
BGA hollow area automatically measured and judged for mobile phone board maintenance, small
electronic circuit board welding point Detection, semiconductor components and other small electronic
components of the internal structure of the detection.
Features:
● high-definition detection images: solder open, short circuit, bubble and other defects at a glance.
● powerful analysis and measurement tools: automatic measurement of solder bubble ratio, automatically
determine whether the IPC international standards.
● safe radiation protection system: the use of seamless lead welding, emergency stop button and safety
interlock device to ensure high safety equipment.
● professional remote technical support: set safe, efficient and convenient as one, without going out
will be able to solve the problem of professional.
Thông số kỹ thuật
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project
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name
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parameter
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Machine status
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size
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780 × 660 × 750 mm
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weight
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300KG
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power supply
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220VC / 50Hz
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power
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0.5KW
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X-ray tube
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Type of light pipe
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Closed tube
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Maximum tube voltage
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100KV
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Maximum tube current
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200μA
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Minimum focus size
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5 μm
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Geometric magnification
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25X
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Image intensifier
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Imager
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Flat panel detectors
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Resolution
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208Lp / cm
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Stage
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Maximum load size
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220 × 250mm
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Maximum detection size
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200 × 200mm
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Tilt detection angle
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360 °
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Movement mode
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Manual control
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safety
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