Hệ thống ghi nhiệt độ quá trình sấy SolderStar APS
The SolderStar APS provides full time process monitoring of the reflow soldering process, the system is capable of recording process conditions and the temperature profile for every electronic assembly that passes through the assembly line.
Ultra-thin temperature probes are permanently mounted along the length of each oven conveyor allowing measurement of variation within product level temperature. This newly developed probe allows for a smaller physical size which offers two significant advantages, fast response to changing oven loading and the reduction of shadowing problems associated with components mounted close to the conveyor rails.
Product speed and position are monitored by way of dedicated speed monitoring instrumentation, combined with optical sensors and a new software algorithm, resulting in a 'True Profile' for every board processed. PC software automatically calculates all important process parameters and checks for values outside defined limits for the process