Rohde-schwarz - Test System Versatile Platform Compact TSVP

Mã sản phẩm:	TSVP
Sử dụng cho Model:
Hãng SX:	Rohde - Schwarz
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Tình trạng: Còn hàng

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Liên Hệ Hỗ Trợ

- SĐT: 0984 843 683
- Mail: info@ttech.vn
- - Zalo: 0984.843.683

Thông tin sản phẩm

Key Facts

Comprehensive system approach:
- System oriented, compact basic unit and modular instruments for DC-, LF- und RF- signals from own production
- Floating stimulus und measurement technology
- Optimized signal concept (analog measurement bus, Rear I/O concept)
- Conceptual solutions to handle high voltages and currents
- Integration of DUT supply modules and loads
- Integrated adaptation concept for DUTs
- System technology allows combination of functional and in-circuit test
- Wide range of functionality in a compact system design, ideal for in-line applications
High test speed (by „intelligent“ modules)
Standardized and powerful software modules (GTSL, EGTSL) with simulation and tracing possibilities
Support of the operating system Microsoft Windows XP™
Integration of cPCI/PXI-Modules from the market without modifiation
Integrated selftest secures readiness of system use and allows detailed diagnostics in case of system fault
On site calibration possible

Brief Description

The R&S^®CompactTSVP family of products is an open test platform based on CompactPCI and PXI and has been developed for high-performance ATE applications. The chassis contains a mechanical frame, digital backplane, analog backplane, mains switching and filtering, power supply and diagnostic extensions.

The R&S^®CompactTSVP is offered as a test and measurement platform (R&S^®TS-PCA3) and as a switching application platform (R&S^®TS-PWA3). Various measurement modules for industrial use in research, development and production are available.