Ion Beam Milling System Leica EM TIC 3X
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Achieving high quality cross-sections of almost any material, revealing the internal structures of the sample with scarcely any deformation or damage was never before more convenient than now, using the Leica EM TIC 3X.
The Triple Ion Beam Milling System, Leica EM TIC 3X allows production of cross sections of hard/soft, porous, heat sensitive, brittle and heterogeneous material for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.
Three individually controlled ion beams , rotary stage, cooling stage and multiple sample stage ensure milling at high rates, cutting broad and deep into the sample resulting in high quality cross-sections.
Connectivity with the Leica transfer system provides for perfect cryogenic surfacing of biological, geological or industrial samples subsequently transferred under cryo and vacuum conditions to coaters and (cryo) SEM.
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Công ty CP Công Nghệ Đỉnh Cao
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