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This device applies vacuum tape under a vacuum for mounting of workpieces and tape/film.
Simple set the dicing frame and workpiece with dicing tape applied, and operate the switches to mount tape to workpiece.
The vacuum mounting method helps prevent air bubbles between the wafer and the tape.
Vacuum processing afterwards prevents swelling of bubbles and oxygen inhibition during UV irradiation.
Adoption of contactless differential pressure mounting system that does not use rollers.
No damage to patterns in comparison with roller systems.
Support for work sizes from 2 inches to 8 inches in a single device.
Very effective for mountings where conventional roller mountings caused difficulties, such as MEMS wafers, TAIKOR wafers, ceramics, glass, substrates, and films.
Equipped to automatic device to provide totally automatic installation due to cassette feeding. Adding a precutting function provides powerful backup to your production line in both cost and quality !
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