This is a fully automatic tape remover with a UV irradiation system (scanning system) for removing protection tapes attached to dicing rings and wafers.
An ultrasonic adhesion head is installed to the remover unit for the first time in the industry. Tape removal without removal tapes is possible. (patented)
Tape-less
Uniquely designed removal unit eliminates the use of removal tapes which used to be a common practice in the industry. The cost for such removal tapes is "$0"!
Compact design
A compact design realized by minimizing the foot space.
Customized configuration
It is possible to customize the equipment based on the work pieces to be processed. For example, a table with a built-in heater and a thin work carrier arm.
Environment friendly
Elimination of the use of tapes also reduces waste. This contributes to the CO2 reduction activities of companies.
Energy-saving
UV irradiation unit with LED illumination (scanning system). Long life! Low energy consumption!